Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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{{Template:Peg2configcontent1 | {{Template:Peg2configcontent1 | ||
|ItemName= Electrostatic clamping, chip bonding with Galden oil and helium backside cooling are no longer being used. | |ItemName= Electrostatic clamping, chip bonding with Galden oil and helium backside cooling are no longer being used. | ||
|ItemConfiguration= The processes run in Pegasus 2 operate at such low powers that they do not require very efficient cooling. It has therefore been decided that | |ItemConfiguration= The processes run in Pegasus 2 operate at such low powers that they do not require very efficient cooling. It has therefore been decided that the following options/procedures | ||
* Electrostatic clamping of carriers/substrates | * Electrostatic clamping of carriers/substrates | ||
* Helium backside cooling | * Helium backside cooling | ||
* Using bonding procedures such as droplets of Galden oil to increase thermal contact between chips and carrier will no longer be required. | * Using bonding procedures such as droplets of Galden oil to increase thermal contact between chips and carrier | ||
will no longer be required. | |||
|ItemComment= So far we have not seen any changes in the results but if you do, please contact Nanolab staff. | |ItemComment= So far we have not seen any changes in the results but if you do, please contact Nanolab staff. | ||
}} | }} | ||