Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions
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*[[/Acceptance Test|Acceptance Test]]. Describes '''thickness uniformity''' tests, '''side wall deposition''' tests, '''sheet resistance''' tests and tests of the '''ion source''' for substrate cleaning. | *[[/Acceptance Test|Acceptance Test]]. Describes '''thickness uniformity''' tests, '''side wall deposition''' tests, '''sheet resistance''' tests and tests of the '''ion source''' for substrate cleaning. | ||
====Materials for e-beam evaporation==== | ====Materials for e-beam evaporation==== | ||
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Note that to date (May 2022) we have processes available for deposition of Al, Cr, Cu, Ge, Au, Ni, Nb, Pd, Pt, Ag, Ti, W and Ta as well as Ru. If your favorite metal is not available you are welcome to ask if we can buy a target and develop a recipe. | Note that to date (May 2022) we have processes available for deposition of Al, Cr, Cu, Ge, Au, Ni, Nb, Pd, Pt, Ag, Ti, W and Ta as well as Ru. If your favorite metal is not available you are welcome to ask if we can buy a target and develop a recipe. | ||
===Thickness measurement, deposition rate and process control=== | |||
Read about how the machine measures the thickness of the growing film using a quartz crystal monitor, how accurately you can control the rate/thickness, and other useful information about e-beam deposition here: [[/Good to know about the Temescal#Deposition rate and thickness measurement accuracy|Thickness, rate, process control]]. | |||
===Particulates in the films=== | |||
Read about optimizing film quality including how to minimize the number of [[/Particulates in Temescal Au films|particulates in Au films in the Temescal]]. | |||
==Equipment performance and process related parameters for the Temescal E-beam evaporator== | ==Equipment performance and process related parameters for the Temescal E-beam evaporator== | ||