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Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions

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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,580 edits
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,580 edits
Line 91: Line 91:
* Electrostatic clamping of carriers/substrates
* Electrostatic clamping of carriers/substrates
* Helium backside cooling
* Helium backside cooling
* Using bonding procedures such as droplets of Galden oil to increase thermal contact between chips and carrier
* Using bonding procedures such as droplets of Galden oil to increase thermal contact between chips and carrier will no longer be required.
will no longer be required.
|ItemComment= So far we have not seen any changes in the results but if you do, please contact Nanolab staff.
|ItemComment= The
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