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Specific Process Knowledge/Characterization/Topographic measurement: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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Reet (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,745 edits
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Generel description
|Profiler for measuring microstructures. Excellent stress measurements. Can also do wafer mapping and roughness measurements.
|Profiler for measuring microstructures. Excellent stress measurements. Excellent sequence programs. Also wafer mapping and roughness measurements.
|Profiler for measuring microstructures. Can do wafer mapping, roughness and stress measurements.
|Profiler for measuring microstructures. Quick and easy vertical profiling. Also wafer mapping, roughness and stress measurements.
|3D Profiler for measuring microstructures and surface roughness. Can do wafer mapping.
|3D Profiler for measuring microstructures and surface roughness. Can do wafer mapping.
|3D Profiler for measuring microstructures and surface roughness. Can do wafer mapping. Located in the basement.
|3D Profiler for measuring microstructures and surface roughness. Can do wafer mapping. Located in the basement.
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