Specific Process Knowledge/Characterization/Topographic measurement: Difference between revisions
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At DTU Nanolab we have eight systems for topographic measurements: | At DTU Nanolab we have eight systems for topographic measurements: | ||
* | *Stylus profilers (P17, Dektak XTA, Dektak 150 and Dektak 3ST) - ''Profilers for measuring micro structures'' | ||
*Optical profilers (Optical profiler Sensofar and Optical profiler Filmetrics) - ''3D Profilers for measuring micro structures'' | *Optical profilers (Optical profiler Sensofar and Optical profiler Filmetrics) - ''3D Profilers for measuring micro structures'' | ||
*AFMs (AFM Icon-PT1 and AFM Icon-PT2) - ''AFMs for measuring nano structures'' | *AFMs (AFM Icon-PT1 and AFM Icon-PT2) - ''AFMs for measuring nano structures'' | ||
==High | ==High aspect ratio structures== | ||
The fact that the stylus tip of a | The fact that the stylus tip of a stylus profiler or an AFM is shaped like a cone with some finite tip angle causes a problem when characterizing high aspect ratio structures. For instance, if a 20 µm wide trench is etched deeper than approximately 18 µm, the tip of the Dektak will not be able to reach the bottom. The optical profiler uses a light beam that is focused through an objective. Therefore it is able to measure higher aspect ratios. The aspect ratio is limited by the possibility for the light to reach the bottom and get back to the detector. On some samples we have been able to measure aspect ratios above 1:10. Otherwise the solution is to cleave the sample along a line that is perpendicular to the trench and then inspect the profile in a [[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|scanning electron microscope]] or a microscope (for large structures). | ||
==Thin film thickness== | ==Thin film thickness== | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Generel description | !Generel description | ||
|Profiler for measuring microstructures. Can do wafer mapping | |Profiler for measuring microstructures. Excellent stress measurements. Can also do wafer mapping and roughness measurements. | ||
|Profiler for measuring microstructures. Can do wafer mapping and stress measurements. | |Profiler for measuring microstructures. Can do wafer mapping, roughness and stress measurements. | ||
|3D Profiler for measuring microstructures and surface roughness. Can do wafer mapping. | |3D Profiler for measuring microstructures and surface roughness. Can do wafer mapping. | ||
|3D Profiler for measuring microstructures and surface roughness. Can do wafer mapping. Located in the basement. | |3D Profiler for measuring microstructures and surface roughness. Can do wafer mapping. Located in the basement. | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!'''Stress measurement''' | !'''Stress measurement''' | ||
| | |Excellent capability | ||
|Can be done | |Can be done | ||
|No stress calculation capability | |No stress calculation capability | ||
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|Cleanroom F-2 | |Cleanroom F-2 | ||
|Cleanroom B-1 | |Cleanroom B-1 | ||
|Cleanroom | |Cleanroom C-1 | ||
|Basement, building 346, room 904 | |Basement, building 346, room 904 | ||
|AFM Icon1: Cleanroom C-1 | |AFM Icon1: Cleanroom C-1 | ||