Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions

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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>Die bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Die bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Flip-chip bonder</b>
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|-
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
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*Fine placement of dies
*Fine placement of dies
*Eutectic metal soldering
*Eutectic metal soldering
|style="background:WhiteSmoke; color:black"|
*Fine placement of dies
*Glue attachment
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Performance
!style="background:silver; color:black;" align="center" width="60"|Performance
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*Low thermal resistance
*Low thermal resistance
*Always conducting
*Always conducting
|style="background:WhiteSmoke; color:black"|
*Medium or High thermal resistance
*Possibility of both conducting and isolating adhesives
*If an epoxy based adhesive is used the user is required to have the epoxy course.
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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*Should be able to withstand the soldering temperature
*Should be able to withstand the soldering temperature
*Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)
*Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)
|style="background:WhiteSmoke; color:black"|
*Any that is compatible with the glue and temperature used
|-  
|-  
|}
|}


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Revision as of 12:11, 23 March 2022

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The Die-bonder Cammax EDB-80 is placed in the Packlab in building 347, 1st floor.
Heating Chuck on the Die-bonder

Die bonder (eutectic metal soldering)

The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.

The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.

The user manuals, user APVs, technical information and contact information can be found in LabManager:

Die Bonder in LabManager

Process information









Equipment performance and process related parameters

Equipment Die bonder
Purpose
  • Fine placement of dies
  • Eutectic metal soldering
Performance
  • Low thermal resistance
  • Always conducting
Substrates Allowed materials
  • Should be able to withstand the soldering temperature
  • Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)


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