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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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==Plasma Asher 2==
==Plasma Asher 3: Descum==
[[Image:Plasma_Asher_6inch.jpg|300x300px|thumb|Plasma asher for removing AZ resist on 6" wafers: positioned in E-5]]
[[Image:Plasma_Asher_6inch.jpg|300x300px|thumb|Plasma asher for removing AZ resist on 6" wafers: positioned in E-5]]


'''Feedback to this section''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_2 click here]'''
'''Feedback to this section''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_3 click here]'''


The Plasma Asher 2 is the same as Plasma Asher 1 but has another loading system which is more convenient for batch loading of 6inch substrates.  
The Plasma Asher 3: Descum dedicated for resist descum i.e. removal of remains resist traces after development. It has a small chamber, so you can only load one 4 inch substrate ad time or few smaller pieces.


In this machine, only O2 and N2 gases are used for processes (in PlasmaAsher1, CF4 is used as well).
In this machine, only O2 and N2 gases are used for processes.


The typical process parameters when operating the equipment:
The typical process parameters when operating the equipment:
*Photeresist stripping
Pressure: 0.8 - 1.0 mbar


*Photeresist descum
Pressure: 0.2 - 0.8mbar
Gas: O2
Gas: O2
 
Power: 50% - 100%
Power: 600 - 1000 watts
Time: 1 -10 min., depending on photoresist type and thickness
 
Time: 5 -30 min., depending on photoresist type and thickness
 
A typical process time for stripping of 1.5 um AZ5214e resist is 25 min for 6 wafers load in a boat, recipe 18.
 
A Descum process in manual mode: O2:70, N2:70, power:150W, time:10 min
 
Be sure to wait for cooling if the mashine has been used at 1000W right before.
At a load at 2 Fused silica wafers resist removed 0.01-01,5um


The other materials have not been tested yet.
The other materials have not been tested yet.


'''The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=200 LabManager]'''
'''The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=423 LabManager]'''


===Process Information===
===Process Information===
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=Resist Strip=
=Resist Strip=


Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Strip"