Specific Process Knowledge/Lithography/Descum: Difference between revisions
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Plasma Asher 3 is specially used for control descum process after lithography. Please notice that you only can process one 4 inch wafer or one small sampel ad time. | Plasma Asher 3 is specially used for control descum process after lithography. Please notice that you only can process one 4 inch wafer or one small sampel ad time. | ||
Machine is equipt with 2 gaslines: oxydgen and nitrogen, but all test run with oxydgen as recommended by Diener. | Machine is equipt with 2 gaslines: oxydgen and nitrogen, but all test run with oxydgen as recommended by Diener. | ||
Ashing of AZ MiR701 resist | |||
You can use different strategy planing your descum: you can change power settings or you can vary chamber pressure during descum. | |||
Testing different power settings | |||
recipe settings: | |||
Oxydgen: 5 sccm under process | |||
Pressure: 0,2mbar | |||
Ashing of AZ5214E resist | |||