Specific Process Knowledge/Lithography/Descum: Difference between revisions
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===[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_3: Plasma asher 3]=== | ===[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_3: Plasma asher 3]=== | ||
Plasma Asher 3 is specially used for control descum process after lithography. Please notice that you only can process one 4 inch wafer or one small sampel ad time. | |||
Machine is equipt with 2 gaslines: oxydgen and nitrogen, but all test run with oxydgen as recommended by Diener. | |||