Specific Process Knowledge/Thin film deposition/Deposition of CrSi: Difference between revisions
Created page with "=CrSi as a hard mask= Cr is of particular interest in the dry etch as it serves as a durable hard mask in the quest to go beyond an aspect ratio of 100 in Si etching. To have..." |
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This page presents the results of CrSi bilayer deposition using <b>DC</b> (for Cr) and <b>RF</b> (for Si) Sputtering in Sputter-System Metal-Oxide(PC1) tool commonly known as "Cluster Lesker". The deposition targets are 3" <b>Cr</b> and <b>Si</b>. Source #3(DC) and #1(RF) was used. | This page presents the results of CrSi bilayer deposition using <b>DC</b> (for Cr) and <b>RF</b> (for Si) Sputtering in Sputter-System Metal-Oxide(PC1) tool commonly known as "Cluster Lesker". The deposition targets are 3" <b>Cr</b> and <b>Si</b>. Source #3(DC) and #1(RF) was used. | ||
The deposition and characterization described below were conducted in <b>2021 by Evgeniy Shkondin, DTU Nanolab</b>. Spectroscopic Ellipsometry and X-ray reflectivity was used for characterization. The main focus of the study was the deposition rate and thickness measurements. | The deposition and characterization described below were conducted in <b>2021 by Evgeniy Shkondin and Henri Jansen, DTU Nanolab</b>. Spectroscopic Ellipsometry and X-ray reflectivity was used for characterization. The main focus of the study was the deposition rate and thickness measurements. | ||
=Recipe= | =Recipe= | ||