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Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions

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Platinum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.
Platinum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.


* [[Specific Process Knowledge/Thin film deposition/Deposition of Platinum/Deposition of Pt in Sputter System (Lesker)|Deposition of Pt in Sputter System (Lesker)]]
* [[Specific Process Knowledge/Thin film deposition/Deposition of Platinum/Deposition of Pt in Sputter System (Lesker)|Deposition of Platinum in Sputter System (Lesker)]]




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|0.5Å/s to 10Å/s
|0.5Å/s to 10Å/s
|0.5Å/s to 10Å/s
|0.5Å/s to 10Å/s
|? Å/s to ? Å/s
|up to 3.74 Å/s
|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
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