Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride: Difference between revisions
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→Comparison of LPCVD, PECVD and Lesker sputter system for silicon nitride deposition: Added sputter-system metal-nitridePC3 and metal-oxide PC1 |
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*[[/Deposition of silicon nitride using Lesker sputter system|Nitride deposition using Lesker sputter system]] | *[[/Deposition of silicon nitride using Lesker sputter system|Nitride deposition using Lesker sputter system]] | ||
*[[/Deposition of silicon nitride using Sputter-System Metal-Oxide(PC1)|Nitride deposition using Sputter-System Metal-Oxide(PC1)]] | |||
==Comparison of LPCVD, PECVD, and sputter systems for silicon nitride deposition== | ==Comparison of LPCVD, PECVD, and sputter systems for silicon nitride deposition== | ||