Specific Process Knowledge/Back-end processing/Disco Saw

Disco Automatic dicing saw, model DAD321

Dicer positioned on 1. floor bldg 346 room 157

The dicer feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.

The dicer at DANCHIP is placed in room 157 on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicing process is very dirty. Think about how to clean your samples if you want to bring them back in the cleanroom.

Overview of the performance Disco DAD321 Dicer

Purpose	Equipment for dicing out samples	Pure Silicon samples Silicon bonded to Silicon Silicon bonded to Pyrex/Borofloat Pyrex/Borofloat
Performance	X-axis cutting range	192 mm
	X-axis cut speed	0.1 - 300 mm/sec
	Y-axis cutting range	162 µm
	Y-axis index step	0.0002 mm
	Y-axis single error	0.003 or less
Hardware settings	Maximum blade size	ø76.2 mm
Substrates	Substrate size	up to 6"
	Layers that can't be diced	Thick metal (>0.75 mm) III-V samples

Comparing dicing parameters for different materials

	Silicon	Pyrex or bonded Si/Pyrex
Bladetype	HUB Blade ZH05 (27HEEF)	HUBless Blade B1A862
Cutlinewidth	60 µm	150 µm
Recommended feed speed	Up to 5 mm/sec	Up to 2 mm/sec (0.5 mm/sec)
Recommended dice depth	Leave 200 µm uncut(preferred). It is possible to cut through the sample.	Leave 200 µm uncut (preferred). It is possible to cut through the sample.
Max. sample thickness	1.5 mm	2.0 mm

Images of diced samples

Si V-groove diced with ZH05 blade