Specific Process Knowledge/Wafer and sample drying/Critical Point Dryer: Difference between revisions
No edit summary |
No edit summary |
||
| Line 58: | Line 58: | ||
After drying wafers in air, the majority of the cantilevers are bended and sticking to the underlying surface. | After drying wafers in air, the majority of the cantilevers are bended and sticking to the underlying surface. | ||
[[Image:SiN | [[Image:SiN dried air.jpg|300x300px|center|Dried in air: most cantilevers are bended.]] | ||
Dried in air: most cantilevers are bended. | Dried in air: most cantilevers are bended. | ||