Specific Process Knowledge/Back-end processing

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Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.

Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.

Choose an equipment

• Stylus profilometer measurements
  • Stylus Profiler:Dektak150
• Substrate/chip/die cleaning
  • Packlab Plasma Asher Pico 2
• Chip/die mounting
  • Die Bonder (eutectic metal)
  • Flip-chip Bonder (glue)
• Wire bonding
  • TPT Wire Bonder
  • Ball Wire Bonder
• Wafer dicing/machining
  • Polisher CMP - located in the cleanroom
  • Polisher/Lapper machine
  • LatticeAxe
  • FlipScribe
  • FlexScribe
  • Wafer Scriber
  • Dicing Saw Disco DAD 321 (old saw)
  • Dicing Saw Disco DAD 3241 (new saw 2021)
  • Wafer cleaner DCS 1441 (post dicing)
  • Laser Micromachining Tool
• Molding
  • Polymer Injection Molder
  • Hot Embosser
• X-ray inspection system
  • X-ray Focal Spot inspection system

Choose processing method

Lapping/polishing	Cutting	Milling	Die bonding	Wire bonding
Polisher/Lapper machine	Wafer Scriber LatticeAxe FlipScribe FlexScribe Dicing Saw Disco DAD 321 (old saw) Dicing Saw Disco DAD 3241 (new saw 2021) Laser Micromachining Tool	Laser Micromachining Tool	Die Bonder (eutectic metal) Flip-chip Bonder (glue)	TPT Wire Bonder Ball Wire Bonder