Specific Process Knowledge/Wafer and sample drying/Critical Point Dryer: Difference between revisions
New page: '''Critical Point Dryer''' The critical point dryer is used to dry fragile structures that may be damaged in a normal drying procedure. Fragile structures may be thin membranes, or free h... |
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'''This page is under construction and the values and data below are not all correct right now./ KN''' | |||
'''Critical Point Dryer''' | '''Critical Point Dryer''' | ||
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Purpose | {| border="2" cellspacing="0" cellpadding="10" | ||
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!style="background:silver; color:black;" align="left"|Purpose | |||
|style="background:LightGrey; color:black"|Drying of wafers or chips | |||
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To dry fragile structures (example membranes, grippers, cantilevers). | |||
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!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Process parameter range | |||
|style="background:LightGrey; color:black"|Process Temperature | |||
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*Room temperature to 500<math>\rm{^o}</math>C | |||
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|style="background:LightGrey; color:black"|Process pressure | |||
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*~5<math>\cdot</math>10<sup>-4</sup>mbar - 2000mbar | |||
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|style="background:LightGrey; color:black"|Piston Force | |||
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*Depending on the area, for 4" wafers 200-20000N. | |||
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!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Batch size | |||
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*One 4" or 6" wafer per run | |||
*Pieces are only allowed with speciel permission | |||
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| style="background:LightGrey; color:black"|Substrate material allowed | |||
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*Silicon wafers | |||
*Quartz wafers | |||
*Pyrex wafers | |||
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| style="background:LightGrey; color:black"|Material allowed on the substrate | |||
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*Silicon oxide | |||
*Silicon (oxy)nitride | |||
*Poly Silicon | |||
*Photoresist | |||
*PMMA | |||
*TOPAS | |||
*SU-8 | |||
*Metals: Au, Sn, Ag, Al, Ti. | |||
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Process parameter range Process Temperature 0 oC temperature to 45oC | Process parameter range Process Temperature 0 oC temperature to 45oC | ||
Process pressure 1 atm to (maximum) 95 atm (1400 PSI) | Process pressure 1 atm to (maximum) 95 atm (1400 PSI) | ||