Specific Process Knowledge/Thin film deposition/Deposition of Niobium: Difference between revisions
| Line 31: | Line 31: | ||
!Layer thickness | !Layer thickness | ||
|10Å to | |10Å to 200 nm* | ||
|10Å to | |10Å to 600 nm** | ||
|- | |- | ||
| Line 38: | Line 38: | ||
! Deposition rate | ! Deposition rate | ||
|0.5Å/s to | |0.5Å/s to 5Å/s | ||
| ~1Å/s | | ~1Å/s | ||
|- | |- | ||
| Line 83: | Line 83: | ||
|} | |} | ||
'''*''' ''To deposit layers thicker than | '''*''' ''To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@danchip.dtu.dk)'' | ||
'''**''' ''To deposit layers thicker than | '''**''' ''To deposit layers thicker than 600 nm permission is required to ensure that there is enough metal (contact metal@danchip.dtu.dk)'' | ||