Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
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Adhesion promoters for dip or spin-on application are commercially available. Most are solvent based with some, usually proprietary, additives. They work by first cleaning the substrate surface, and subsequently priming the surface with the additives as the solvent evaporates. | Adhesion promoters for dip or spin-on application are commercially available. Most are solvent based with some, usually proprietary, additives. They work by first cleaning the substrate surface, and subsequently priming the surface with the additives as the solvent evaporates. | ||
'''Hard bake:''' | |||
If the adhesion between the substrate surface and the resist is sufficient to survive the development process, the adhesion in subsequent process steps can be improved by a so-called hard bake. Baking the substrate a few minutes on a hotplate (or approx. half an hour in a convection oven) at a temperature higher than the soft bake temperature, e.g. 110-130°C, usually improves the adhesion between resist and surface. Depending on the type of resist used, and the temperature of the hard bake, reflow of the resist pattern may be a side effect. | |||
==Comparing pretreatment methods== | ==Comparing pretreatment methods== | ||