Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions

@@ Line 96: / Line 96: @@
 '''This section is under construction [[Image:section under construction.jpg|70px]]'''
+{| {{table } }
+|  width="50" align="center" style="background:#f0f0f0;"|
+|  width="50" align="center" style="background:#f0f0f0;"|'''Dehydration'''
+|  width="50" align="center" style="background:#f0f0f0;"|'''BHF dip'''
+|  width="50" align="center" style="background:#f0f0f0;"|'''HMDS'''
+|  width="50" align="center" style="background:#f0f0f0;"|'''Dip/spin-on adhesion promoter'''
+|-
+|-style="background:#DCDCDC;" align="center"
+|align="left"| Silicon with native oxide || (x) || x || X || (x)
+|-
+|-style="background:#C0C0C0;" align="center"
+|align="left"|Silicon oxide || (x) ||  || X || (x)
+|-
+|-style="background:#DCDCDC;" align="center"
+|align="left"| Silicon nitride || (x) ||  || X || (x)
+|-
+|}
 =HMDS=