Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions
| Line 43: | Line 43: | ||
|10 Å/s to 15 Å/s (e-beam) | |10 Å/s to 15 Å/s (e-beam) | ||
Sputtering: Depends on process parameters. See [[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Sputtering of Cr in Wordentec|here]] and process log. | Sputtering: Depends on process parameters. See [[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Sputtering of Cr in Wordentec|here]] and process log. | ||
| | |1 Å/s | ||
|Depends on process parameters. At least up to 2 Å/s. See process log. | |Depends on process parameters. At least up to 2 Å/s. See process log. | ||
|Depends on process parameters. | |Depends on process parameters. | ||