Specific Process Knowledge/Etch/Etching of Silicon Oxide: Difference between revisions
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*[[Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide Etch]] | *[[Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide Etch]] | ||
*[[/ | *[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4|SiO2 etch with DRIE Pegasus 4]] | ||
*[[Specific_Process_Knowledge/Etch/III-V_RIE/III_V_RIE_ETCHES#CHF3.2FO2_etch |SiO2 etch using III-V RIE]] | *[[Specific_Process_Knowledge/Etch/III-V_RIE/III_V_RIE_ETCHES#CHF3.2FO2_etch |SiO2 etch using III-V RIE]] | ||
*[[/SiO2 etch using AOE|SiO2 etch using AOE]] | *[[/SiO2 etch using AOE|SiO2 etch using AOE]] | ||
*[[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher/silicon_oxide|SiO2 etch using ICP metal]] | *[[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher/silicon_oxide|SiO2 etch using ICP metal]] | ||
*[[/SiO2 etch using ASE|SiO2 etch using ASE]] | |||
*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] | *[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] | ||
*[[/SiO2 etch using Plasma Asher|SiO2 etch using Plasma Asher (isotropic)]] | *[[/SiO2 etch using Plasma Asher|SiO2 etch using Plasma Asher (isotropic)]] | ||