Specific Process Knowledge/Characterization: Difference between revisions
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== Choose equipment == | == Choose equipment == | ||
===[[SEM: Scanning Electron Microscopy]]=== | |||
*[[AFM: Atomic Force Microscopy]] | *LEO SEM | ||
*FEI SEM | |||
* | *JEOL SEM | ||
===[[AFM: Atomic Force Microscopy]]=== | |||
===[[Profiler]]=== | |||
*Tencor | |||
*[[Dektak stylus profiler]] | *[[Dektak stylus profiler]] | ||
*Drop shape analyser | ===[[Optical microscope]]=== | ||
===[[Optical characterization]]=== | |||
*ellipsometer | |||
**Filmtek | |||
**prism coupler | |||
===[[SIMS: Secondary Ion Mass Spectrometry]]=== | |||
===Drop shape analyser=== | |||
===4-point probe=== | |||
===Stylus thickness measure=== | |||
Revision as of 13:49, 20 September 2007
Choose topic
- Surface imaging
- Topographic measurement
- Stress measurement
- Filmthickness measurement
- Element analysis
- Measurement of optical constants
- Hydrophobicity measurement
- Resistivity measurement
- Wafer thickness measurement
Choose equipment
SEM: Scanning Electron Microscopy
- LEO SEM
- FEI SEM
- JEOL SEM
AFM: Atomic Force Microscopy
Profiler
- Tencor
- Dektak stylus profiler
Optical microscope
Optical characterization
- ellipsometer
- Filmtek
- prism coupler