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Specific Process Knowledge/Etch/DryEtchProcessing/Bonding: Difference between revisions

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<ol>
  <li>Find a carrier wafer that has the right size. Keep in mind that it matters a great deal if the surface will be etched or not, i.e. if it has oxide or not. </li>
  <li>Find a carrier wafer that has the right size. Keep in mind that it matters a great deal if the surface will be etched or not, i.e. if it has oxide or not. </li>
  <li>Take a piece of crystalbond from the shelf in cleanroom 1. </li>
  <li>Take a piece of crystalbond from the shelf in cleanroom A-1. </li>
  <li>Take your items (substrate, carrier wafer, crystalbond and tweezers) to the hotplate in cleanroom 1. </li>
  <li>Take your items (substrate, carrier wafer, crystalbond and tweezers) to the hotplate in cleanroom C-1. </li>
[[image:bonding-n01x.jpg]]
[[image:bonding-n01x.jpg]]
  <li>Put the carrier wafer on the hotplate. A 6" wafer will fit not in the recess but it will get sufficiently hot if you leave it there for some seconds longer. </li>
  <li>Put the carrier wafer on the hotplate. <!-- A 6" wafer will fit not in the recess but it will get sufficiently hot if you leave it there for some seconds longer. --> </li>
  <li>Apply a very thin layer of crystalbond in a circular motion so that it covers some 70 % of the area to be covered by your substrate. Do not apply too much! Little does it.. </li>
  <li>Apply a very thin layer of crystalbond in a circular motion so that it covers some 70 % of the area to be covered by your substrate. Do not apply too much! Little does it.. </li>
  <li>Gently put your wafer on the crystalbond. </li>
  <li>Gently put your wafer on the crystalbond. </li>