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Specific Process Knowledge/Thermal Process/RTP Jipelec 2: Difference between revisions

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The temperature is measured by either a thermocouple or an optical pyrometer. The temperature is regulated by a PID controller, thus the PID values will have to be optimized for each susceptor size and for each wafer size and thickness, and it is important to select the right PID table for each process.
The temperature is measured by either a thermocouple or an optical pyrometer. The temperature is regulated by a PID controller, thus the PID values will have to be optimized for each susceptor size and for each wafer size and thickness, and it is important to select the right PID table for each process.


Annealing can be done at atmospheric pressure or in vacuum. It is also possible to apply a flow of either nitrogen or argon during the annealing, and forming gas (4 % H2/96 % N2) will be connected later.  
Annealing can be done at atmospheric pressure or in vacuum. It is also possible to apply a flow of either nitrogen or argon during the annealing, and forming gas (4 % H<sub>2</sub>/96 % N<sub>2</sub>) will be connected later.  




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