Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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Whereas most dry etch tools are intended to serve as stable platforms with limited or no changes in hardware, Pegasus 2 will be subject to experiments. For instance, as of the end of 2020 the instrument has been set up to run [http://labadviser.nanolab.dtu.dk/images/d/d6/CORE1.pdf '''the CORE process''']. This means that comparing to [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-1|DRIE-Pegasus 1]] and | Whereas most dry etch tools are intended to serve as stable platforms with limited or no changes in hardware, Pegasus 2 will be subject to experiments. For instance, as of the end of 2020 the instrument has been set up to run [http://labadviser.nanolab.dtu.dk/images/d/d6/CORE1.pdf '''the CORE process''']. This means that comparing to [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-1|DRIE-Pegasus 1]] and | ||
[[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-3|DRIE-Pegasus 3]], Pegasus 2 and its allowed usage have been modified (this list is not complete - see the complete list in the table below): | [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-3|DRIE-Pegasus 3]], Pegasus 2 and its allowed usage have been modified (this list is not complete - see the complete list in the table below). For instance: | ||
# The C<sub>4</sub>F<sub>8</sub> MFC has been disconnected to maintain a carbon-free (carbon containing masks are allowed) chamber. | # The C<sub>4</sub>F<sub>8</sub> MFC has been disconnected to maintain a carbon-free (carbon containing masks are allowed) chamber. | ||
# The RF generator supplying the power to the coil has been disconnected thus allowing only processes driven by the platen generator. | # The RF generator supplying the power to the coil has been disconnected thus allowing only processes driven by the platen generator. | ||