Specific Process Knowledge/Thin film deposition: Difference between revisions

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Line 9: Line 9:
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|13 Al Aluminium
|[[/Deposition of Aluminium|13 Al Aluminium]]
|14 Si Silicon
|[[/Deposition of Silicon|14 Si Silicon]]
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|22 Ti Titanium
|[[/Deposition of Titanium|22 Ti Titanium]]
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|24 Cr Chromium
|[[/Deposition of Chromium|24 Cr Chromium]]
|28 Ni Nickel
|[[/Deposition of Nickel|28 Ni Nickel]]
|29 Cu Copper
|[[/Deposition of Copper|29 Cu Copper]]
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Line 23: Line 23:
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|46 Pd Palladium
|[[/Deposition of Palladium|46 Pd Palladium]]
|47 Ag Silver
|[[/Deposition of Silver|47 Ag Silver]]
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|50 Sn Tin
|[[/Deposition of Tin|50 Sn Tin]]
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|73 Ta Tantalum
|[[/Deposition of Tantalum|73 Ta Tantalum]]
|74 W Tungsten
|[[/Deposition of Tungsten|74 W Tungsten]]
|78 Pt Platinum
|[[/Deposition of Platinum|78 Pt Platinum]]
|79 Au Gold
|[[/Deposition of Gold|79 Au Gold]]
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=== Polymers ===
=== Polymers ===

Revision as of 10:07, 24 October 2007

Choose material to deposit

Metals/elements

13 Al Aluminium 14 Si Silicon
22 Ti Titanium 24 Cr Chromium 28 Ni Nickel 29 Cu Copper
46 Pd Palladium 47 Ag Silver 50 Sn Tin
73 Ta Tantalum 74 W Tungsten 78 Pt Platinum 79 Au Gold

Polymers

  • SU8
  • Antistiction coating
  • Topas
  • PMMA

Other materials

Choose deposition equipment

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