Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions

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|ItemComment=OnlySF<sub>6</sub> and O<sub>2</sub> are used for Si, PR, and Cr etch. The rest is only make-up
|ItemComment=OnlySF<sub>6</sub> and O<sub>2</sub> are used for Si, PR, and Cr etch. The rest is only make-up
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Revision as of 10:37, 14 December 2020

Feedback to this page: click here

This system is a research tool and not available to the users

If you want to get access to the tool, then talk to professor Henry Jansen


Current setup and rules on Pegasus 2

Click here to access older configurations.

The current configuration is

Currently valid from November 2020 onwards
Item The currently applied modification Comments
Available gasses and gas chemistry Available gasses:
  • SF6: 50 sccm
  • O2: 50 sccm
  • Ar: 283
  • N2: 500 sccm
  • He: 11 sccm

Not available:

  • C4F8 (H2 currently fitted but closed) : 0 sccm
  • CO2: (It is not in the software)
OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up


Access to Pegasus 2 configuration templates

Pegasus 2 configuration table version 1