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Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,580 edits
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{| | A | B|- | C| D|}Available gasses and gas chemistry
{| | A | B|- | C| D|}Available gasses and gas chemistry
|ItemConfiguration=  
|ItemConfiguration=  
{|
* SF6: 50 sccm
<-- | colspan="3 "| C<sub>4</sub>F<sub>8</sub> (H2 currently fitted but closed) : 0 sccm /-->
* O2: 50 sccm
|-
* Ar: 283 sccm
| SF6: 50 sccm
* N2: 500 sccm
| O2: 50 sccm
* He: 11 sccm
| Ar: 283 sccm
* CO2: (It is not in the software)  
|-
| N2: 500 sccm
| He: 11 sccm
| CO2: (It is not in the software)  
|-
|}
|ItemComment=OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up
|ItemComment=OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up
{| | A | B|- | C| D|}}}
|}
|}


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