Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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|ItemName= Available gasses and gas chemistry | |ItemName= Available gasses and gas chemistry | ||
|ItemConfiguration= | |ItemConfiguration= | ||
* C<sub>4</sub>F<sub>8</sub> (H2 currently fitted but closed) : 0 sccm | * C<sub>4</sub>F<sub>8</sub> (H2 currently fitted but closed) : 0 sccm | ||
* SF6: 50 sccm | * SF6: 50 sccm | ||
| Line 29: | Line 30: | ||
* He: 11 sccm | * He: 11 sccm | ||
* CO2: (It is not in the software) | * CO2: (It is not in the software) | ||
|ItemComment=OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up | |ItemComment=OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up | ||
}} | }} | ||