Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
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*Semi-automatic and manual operation | *Semi-automatic and manual operation | ||
*Bond placement laser pointer | *Bond placement laser pointer | ||
*recommended min. bonding area 100 µm | *recommended min. bonding area 100 µm x 100 µm | ||
*recommended temperature 120 <sup>o</sup>C. | *recommended temperature 120 <sup>o</sup>C. | ||
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