Specific Process Knowledge/Wafer and sample drying: Difference between revisions
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|-style="background:lightgray; color:black" | |-style="background:lightgray; color:black" | ||
!Equipment | !Equipment | ||
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryers|Spin dryer 2]] | |[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryers|Spin dryer 2]] | ||
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryers|Spin dryer 3]] | |[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryers|Spin dryer 3]] | ||
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryers|Spin dryer 5]] | |[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryers|Spin dryer 5]] | ||
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Single wafer spin dryers|Single wafer spin dryer 1]] | |[[Specific_Process_Knowledge/Wafer_and_sample_drying #Single wafer spin dryers|Single wafer spin dryer 1]] | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Location | !Location | ||
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*B-1 | *B-1 | ||
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*D-3 | *D-3 | ||
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*F-3 | *F-3 | ||
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|-style="background:lightgray; color:black" | |-style="background:lightgray; color:black" | ||
!Purpose | !Purpose | ||
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*Drying | *Drying | ||
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*Drying | *Drying | ||
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*Drying | *Drying | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Batch size | !Batch size | ||
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*1-25 100 mm wafers | *1-25 100 mm wafers | ||
*1-25 150 mm wafers | *1-25 150 mm wafers | ||
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*1-25 100 mm wafers | *1-25 100 mm wafers | ||
*1-25 150 mm wafers | *1-25 150 mm wafers | ||
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|-style="background:lightgray; color:black" | |-style="background:lightgray; color:black" | ||
!Allowed materials | !Allowed materials | ||
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*Only for RCA cleaned wafers | *Only for RCA cleaned wafers | ||
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*No restrictions | *No restrictions | ||