Specific Process Knowledge/Etch/Etching of Chromium: Difference between revisions
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Etch rate are depending on the level of oxidation of the metal. | Etch rate are depending on the level of oxidation of the metal. | ||
====How to mix the Chromium etch 1:==== | |||
#Take a beaker and add 15g of cerium sulphate. | |||
#Add a little water while stirring - make sure all lumps are gone. | |||
#Add water until 600 ml - keep stirring (use magnetic stirring) | |||
#Add 90 ml HNO<math>_3</math> | |||
#When the cerium sulphate is completely dissolved (Clear liquid) you can add the other 600 ml of wafer. | |||
Revision as of 15:00, 9 November 2009
Etching of Chromium
Etching of chromium is done wet at Danchip making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. We have two solution for this:
- HNO:HO:cerisulphate - 90ml:1200ml:15g - standard at Danchip
- Commercial chromium etch
Etch rate are depending on the level of oxidation of the metal.
How to mix the Chromium etch 1:
- Take a beaker and add 15g of cerium sulphate.
- Add a little water while stirring - make sure all lumps are gone.
- Add water until 600 ml - keep stirring (use magnetic stirring)
- Add 90 ml HNO
- When the cerium sulphate is completely dissolved (Clear liquid) you can add the other 600 ml of wafer.
Overview of the data for the chromium etches
Chromium etch 1 | Chromium etch 2 | |
---|---|---|
General description |
Etch of chromium |
Etch of chromium |
Chemical solution | HNO:HO:cerisulphate - 90ml:1200ml:15g | . |
Process temperature | Room temperature | . |
Possible masking materials |
Photoresist (1.5 µm AZ5214E) |
. |
Etch rate |
~40-100 nm/min |
. |
Batch size |
1-25 wafers at a time |
. |
Size of substrate |
4" wafers |
. |
Allowed materials |
No restrictions. Make a note on the bottle of which materials have been processed. |
. |