Specific Process Knowledge/Thin film deposition: Difference between revisions
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*Alcatel - ''E-beam evaporator and sputter tool'' | *Alcatel - ''E-beam evaporator and sputter tool'' | ||
*Lesker - ''Sputter tool'' | |||
*Leybold - ''E-beam evaporator and multiple wafer tool'' | *Leybold - ''E-beam evaporator and multiple wafer tool'' | ||
*Wordentec - '' | *Wordentec - ''E-beam evaporator, sputter and thermical evaporator'' | ||
*Hummer - ''Gold sputtering system'' | *Hummer - ''Gold sputtering system'' | ||
*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition'' | *[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition'' | ||
Revision as of 08:04, 24 October 2007
Choose material to deposit
Metals
- Aluminium
- Nickel
- Titanium
- Gold
Polymers
- SU8
- Antistiction coating
- Topas
- PMMA
Other materials
Choose deposition equipment
- Alcatel - E-beam evaporator and sputter tool
- Lesker - Sputter tool
- Leybold - E-beam evaporator and multiple wafer tool
- Wordentec - E-beam evaporator, sputter and thermical evaporator
- Hummer - Gold sputtering system
- PECVD - Plasma Enhanced Chemical Vapor deposition
- B2 Furnace LPCVD Nitride - Deposition of silicon nitrid
- B3 Furnace LPCVD TEOS - Deposition of silicon oxide
- B4 Furnace LPCVD PolySilicon - Deposition of polysilicon
- MVD - Molecular Vapor Deposition