Specific Process Knowledge/Characterization: Difference between revisions
No edit summary |
No edit summary |
||
| Line 37: | Line 37: | ||
===[[/4-Point Probe|4-Point Probe]]=== | ===[[/4-Point Probe|4-Point Probe]]=== | ||
===[[/Thickness Measurer|Thickness Measurer]]=== | ===[[/Thickness Measurer|Thickness Measurer]]=== | ||
===[[/Probe station|Probe station]]=== | |||
Revision as of 11:54, 23 October 2007
Choose topic
- Surface imaging
- Topographic measurement
- Stress measurement
- Measurement of optical constants
- Film thickness measurement
- Wafer thickness measurement
- Element analysis
- Hydrophobicity measurement
- Resistivity measurement
- Other electrical measurements
Choose equipment
SEM: Scanning Electron Microscopy
- FEI SEM
- JEOL SEM
- LEO SEM
AFM: Atomic Force Microscopy
- Nanoman - AFM
Profiler
- Dektak 8 stylus profiler
- Tencor
Optical microscope
Optical characterization
- Ellipsometer
- Filmtek
- Prism Coupler
SIMS: Secondary Ion Mass Spectrometry
- Atomika SIMS