Specific Process Knowledge/Thin film deposition/Deposition of Silicon: Difference between revisions
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m →Comparison of the methods for deposition of Silicon: added link to info on deposition rate |
m →Comparison of the methods for deposition of Silicon: edit cluster sputter name |
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! Sputter ([[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]]) | ! Sputter ([[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]]) | ||
! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
! Sputter ([[Specific Process Knowledge/Thin film deposition/Cluster- | ! Sputter ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]]) | ||
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