Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions
→Chromium deposition: adding section w cluster sputterer |
→Chromium deposition: added cluster sputter system |
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* Silicon wafers | * Silicon wafers | ||
* and almost any other | * and almost any other. Special carrier for III-V materials. | ||
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*Silicon wafers | |||
*And almost any that does not degas. Special carrier for III-V materials. | |||
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* Mylar | * Mylar | ||
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* almost any | * almost any, see [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=244 cross-contamination sheet] | ||
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*Almost any - see cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3]) | |||
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| Takes approx. 5 min to pump down load lock and 6 min for transfer to processing chamber | |||
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