Specific Process Knowledge/Characterization: Difference between revisions
| Line 1: | Line 1: | ||
== Choose topic == | == Choose topic == | ||
*Surface imaging | *[[/Surface imaging|Surface imaging]] | ||
*Topographic measurement | *[[/Topographic measurement|Topographic measurement]] | ||
*Stress measurement | *[[/Stress measurement|Stress measurement]] | ||
*Measurement of optical constants | *[[/Measurement of optical constants|Measurement of optical constants]] | ||
* | *[[/Film thickness measurement|Film thickness measurement]] | ||
*Wafer thickness measurement | *[[/Wafer thickness measurement|Wafer thickness measurement]] | ||
*Element analysis | *[[/Element analysis|Element analysis]] | ||
*Hydrophobicity measurement | *[[/Hydrophobicity measurement|Hydrophobicity measurement]] | ||
*Resistivity measurement | *[[/Resistivity measurement|Resistivity measurement]] | ||
*Other electrical measurements | *[[/Other electrical measurements|Other electrical measurements]] | ||
== Choose equipment == | == Choose equipment == | ||
Revision as of 10:41, 23 October 2007
Choose topic
- Surface imaging
- Topographic measurement
- Stress measurement
- Measurement of optical constants
- Film thickness measurement
- Wafer thickness measurement
- Element analysis
- Hydrophobicity measurement
- Resistivity measurement
- Other electrical measurements
Choose equipment
SEM: Scanning Electron Microscopy
- FEI SEM
- JEOL SEM
- LEO SEM
AFM: Atomic Force Microscopy
- Nanoman - AFM
Profiler
- Dektak 8 stylus profiler
- Tencor
Optical microscope
Optical characterization
- Ellipsometer
- Filmtek
- Prism Coupler
SIMS: Secondary Ion Mass Spectrometry
- Atomika SIMS