Specific Process Knowledge/Characterization: Difference between revisions
| Line 3: | Line 3: | ||
*Topographic measurement | *Topographic measurement | ||
*Stress measurement | *Stress measurement | ||
*Measurement of optical constants | |||
*Filmthickness measurement | *Filmthickness measurement | ||
*Wafer thickness measurement | |||
*Element analysis | *Element analysis | ||
*Hydrophobicity measurement | *Hydrophobicity measurement | ||
*Resistivity measurement | *Resistivity measurement | ||
* | *Other electrical measurements | ||
== Choose equipment == | == Choose equipment == | ||
Revision as of 10:34, 23 October 2007
Choose topic
- Surface imaging
- Topographic measurement
- Stress measurement
- Measurement of optical constants
- Filmthickness measurement
- Wafer thickness measurement
- Element analysis
- Hydrophobicity measurement
- Resistivity measurement
- Other electrical measurements
Choose equipment
SEM: Scanning Electron Microscopy
- FEI SEM
- JEOL SEM
- LEO SEM
AFM: Atomic Force Microscopy
- Nanoman - AFM
Profiler
- Dektak 8 stylus profiler
- Tencor
Optical microscope
Optical characterization
- Ellipsometer
- Filmtek
- Prism Coupler
SIMS: Secondary Ion Mass Spectrometry
- Atomika SIMS