LabAdviser/314/Preparation 314-307/Solid-matter: Difference between revisions
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[[File:Dimple_Grinder.jpg|200px|left|thumb|Location Building 307, Prep Lab 109]].<br /> | [[File:Dimple_Grinder.jpg|200px|left|thumb|Location Building 307, Prep Lab 109]].<br /> | ||
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== Ultrasonic cutter == | |||
[http://www.labmet.cl/Documentos/Manuales/Manual%20-%20ULTRASONIC%20DISK%20CUTTER%20MODEL%20170.pdf Manual] | |||
[[File:Ultrasonic_Cutter.jpg|200px|left|thumb|Location Building 307, Prep Lab 109]].<br /> | |||
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== Mini grinder/polisher == | == Mini grinder/polisher == | ||
= Sample preparation processes = | = Sample preparation processes = | ||