Specific Process Knowledge/Characterization: Difference between revisions
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|align="left"| Band gap||||||||||||||x|||| | |align="left"| Band gap||||||||||||||x||||x||x|||||||||||||||||||| | ||
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|align="left"| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x 1)||x 1)||||||||||||x|||||||||||||||||||||||| | |align="left"| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x 1)||x 1)||||||||||||x|||||||||||||||||||||||| | ||
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|align="left"| Work function||||||||||||||||B|||||||||||||||||||||||| | |||
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