Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions

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Vthongu (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
188 edits
Line 8: Line 8:
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Nanoscale silicon etching with SF6 and O2|Nanoscale silicon etching with SF6 and O2 ]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Nanoscale silicon etching with SF6 and O2|Nanoscale silicon etching with SF6 and O2 ]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Si Nano Etching|Black silicon on Demand]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Si Nano Etching|Black silicon on Demand]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Nanoscale silicon etching|Nanoscale silicon etching with SF6 and O2 ]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch high aspect ratio silicon microstructures|Etch high aspect ratio silicon microstructures ]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch 3 dimensional silicon microstructures|Etch 3 dimensional silicon microstructures]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch black silicon|Etch black silicon]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Nano Si Etching|Nano Si Etching]]

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