Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
| Line 8: | Line 8: | ||
* [[/Nanoscale silicon etching with SF<sub>6</sub> and O<sub>2</sub>|Nanoscale silicon etching with SF<sub>6</sub> and O<sub>2</sub> ]] | * [[/Nanoscale silicon etching with SF<sub>6</sub> and O<sub>2</sub>|Nanoscale silicon etching with SF<sub>6</sub> and O<sub>2</sub> ]] | ||
*[[/Si Nano Etching|Black silicon on Demand]] | *[[/Si Nano Etching|Black silicon on Demand]] | ||
* [[ | * [[/Etch silicon nanostructures|Etch silicon nanostructures ]] | ||
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch high aspect ratio silicon microstructures|Etch high aspect ratio silicon microstructures ]] | * [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch high aspect ratio silicon microstructures|Etch high aspect ratio silicon microstructures ]] | ||
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch 3 dimensional silicon microstructures|Etch 3 dimensional silicon microstructures]] | * [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch 3 dimensional silicon microstructures|Etch 3 dimensional silicon microstructures]] | ||
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch black silicon|Etch black silicon]] | * [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch black silicon|Etch black silicon]] | ||
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Using OES to monitor etch process|Using OES to monitor etch process]] | * [[Specific Process Knowledge/Etch/DRIE-Pegasus/Using OES to monitor etch process|Using OES to monitor etch process]] | ||
Revision as of 11:26, 11 May 2020
Feedback to this page: click here
This system is a research tool and not available to the users
If you want to get access to the tool, then take to professor Henry Jansen
- [[/Nanoscale silicon etching with SF6 and O2|Nanoscale silicon etching with SF6 and O2 ]]
- Black silicon on Demand
- Etch silicon nanostructures
- Etch high aspect ratio silicon microstructures
- Etch 3 dimensional silicon microstructures
- Etch black silicon
- Using OES to monitor etch process