Specific Process Knowledge/Thin film deposition: Difference between revisions
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{| {{table}} | {| {{table}} | ||
| align="left" valign="top" style="background:LightGray"|''' | | align="left" valign="top" style="background:LightGray"|''' Semiconductors''' | ||
| align="left" valign="top" style="background:#DCDCDC;"|''' | | align="left" valign="top" style="background:#DCDCDC;"|''' Oxides''' | ||
| align="left" valign="top" style="background:LightGray"|''' Metals''' | | align="left" valign="top" style="background:LightGray"|''' Metals''' | ||
| align="left" valign="top" style="background:#DCDCDC;"|''' Nitrides''' | | align="left" valign="top" style="background:#DCDCDC;"|''' Nitrides''' |
Revision as of 08:40, 11 May 2020
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Choose material to deposit
Semiconductors | Oxides | Metals | Nitrides | Alloys | Transparent conductive oxides | Polymers |
Aluminium Oxide (Al2O3)
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Aluminium
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Silicon Nitride - and oxynitride |
AlCu And an electroceramic: YSZ (Yttrium stabilized zirconia) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Choose deposition equipment
PVD | LPCVD | PECVD | ALD | Coaters | Others
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See the Lithography/Coaters page for coating polymers |
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