Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/Si Nano etching: Difference between revisions

=The CORE sequence (meaning Clear, Oxidize, Remove and Etch) is a fluorocarbon-free directional plasma etch procedure that enables a higher selectivity, creates pattern independence of etching profiles and works excellent at room temperature. The CORE process resembles the well-known SF₆-based Bosch process, but the usual C₄F₈ inhibitor is replaced by O₂ oxidation with self-limiting characteristics. Therefore the CORE result is similar to Bosch, however has the advantage of preventing the pile-up of fluorocarbon deposits at the topside of deep-etched or nano-sized features. At the same time, process drift is minimized as the reactor wall is staying perfectly clean. The CORE process has shown an excellent performance in high aspect ratio (3D) nanoscale structures with an accurate and controllable etch rate between 1 and 50 nm min⁻¹ (and SiO₂-selectivity of ca. 35) using the etch-tool in the RIE-mode. By adding the ICP source (DRIE-mode), a directional etch rate up to 1 μm min⁻¹ (at 50 sccm SF₆ flow) and selectivity >200 for SiO₂ is possible.=

==='''The CORE recipe is shown as below'''===

The CORE cycle design rules and optimized recipe for the etch rate  fixed at 15 nm\min

==='''Rule 1''': 2 min E-time needs 2 s O-time. Every 2 min extra E-time will need 1 s extra O-time until a maximum of 14 min E-time.===

==='''Rule 2''': Every second of O-time needs at least 3 s R-time (for 8 min E-time).===

==='''Rule 3''': The undercut is roughly half of the gained etch depth per CORE cycle.===