Specific Process Knowledge/Characterization/XRD/XRD SmartLab

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XRD SmartLab

The Rigaku SmartLab is an advanced XRD for measuring on thin films. All thin films can be measured without fixating the sample, as the system has a so called In-Plane arm.

The XRD SmartLab located in cleanroom F-2

The user manual(s), user APV(s), technical information, and contact information can be found in LabManager:

XRD SmartLab in LabManager

Various measurement types including X-Ray reflectivity, Rocking curve, Theta-2theta, and Pole figures are described here:

Process information

The measurement settings and results of the pre-acceptance test are described in this document, also found on the Cleanroom drive: File:SmartLab_Report_DTUv1.pdf

Software for analysis

The software packages used for data analysis are available on the equipment computer, but we recommend that you install it on your personal computer. To run the software you need a USB dongle with a license on, these can be borrowed from the equipment responsible (in 2020, these were Kristian, Evgeniy, and Rebecca). We only have 9 dongles available, so when you are done please return the dongle to Nanolab.

The software can be found on "CleanroomDrive\_Equipment\XRD\Rigaku software\RILauncher", it should be possible to install the software without a dongle. To use the software you have to log in. The user is: Administrator. There is no password.

Equipment performance and process related parameters

Equipment		XRD SmartLab
Purpose	Crystal structure analysis and thin film thickness measurement	Phase ID Crystal Size Crystallinity Quality and degree of orientation 3D orientation Latice strain Composition Twist 3D lattice constant Thickness Roughness Density
X-ray generator	Maximum rated output	3 kW
	Rated tube voltage	20 to 45 kV
	Rated tube current	2 to 60 mA
	Type	Sealed tube
	Target	Cu
	Focus size	0.4 mm x 8 mm (Line/Point)
Goniometer	Scanning mode	incident / receiver coupled or independent
	Goniomenter radius	300 mm
	Minimum step size	0.0001° (0.36")
	Sample stage	χ:-5~+95° φ:0~360° Z:-4~+1 mm X,Y:±50 mm for a 100 mm wafer Rx,Ry:-5~+5°
	Sample size	Diameter: 150 mm Thickness: 0~21 mm
Optics	Incident side	Cross Beam Optics(CBO) Ge(220)x2 monochromator In-Plane Parallel Slit Collimator (PSC) Soller slit Variable divergence slit
	Receiver side	Automatic variable scattering slit Automatic variable receiver slit Parallel slit analysers (PSA) Ge(220)x2 analyser
Substrates	Substrate size	up to 150 mm wafers
	Allowed materials	All materials

Characterization of thin films using X-ray reflectivity (XRR)

Implementing the XRR method the user can calculate thickness, density, and roughness of the deposited material. The XRR is also widely employed for multilayer stack analysis.

Here are some results available:

• Characterization of e-beam deposited Al thin films.

• Characterization of ALD deposited Al₂O₃ and TiO₂ ultrathin layers.