Specific Process Knowledge/Thin film deposition: Difference between revisions

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+[[/Deposition of Alumina|Aluminium Oxide (Al<sub>2</sub>O<sub>3</sub>)]]<br/>
+[[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|Barium titanate (BaTiO<sub>3</sub>)]]<br/>
+[[/Lesker|Chromium Oxide (Cr<sub>2</sub>O<sub>3</sub>)]]<br/>
+[[/Deposition of Hafnium Oxide|Hafnium Oxide (HfO<sub>2</sub>)]]<br/>
 [[/Deposition of Silicon Oxide|Silicon Oxide (SiO<sub>2</sub>)]]<br/>
 [[/Deposition of Titanium Oxide|Titanium Oxide (TiO<sub>2</sub>)]]<br/>
-[[/Deposition of Alumina|Aluminium Oxide (Al<sub>2</sub>O<sub>3</sub>)]]<br/>
 [[/Lesker|Tantalum Oxide (Ta<sub>2</sub>O<sub>5</sub>)]]<br/>
-[[/Lesker|Chromium Oxide (Cr<sub>2</sub>O<sub>3</sub>)]]<br/>
-[[/Deposition of Hafnium Oxide|Hafnium Oxide (HfO<sub>2</sub>)]]<br/>
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 [[/Lesker|AlCu]]<br/>
-[[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|BaTiO<sub>3</sub>]] (Barium titanate)<br/>
 [[/Lesker|CoFe]]<br/>
 [[/Lesker|CuTi]]<br/>
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 [[/Deposition of NiV|NiV]] alloy <br/>
 [[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>
+And an electroceramic:
 [[/Lesker|YSZ]] (Yttrium stabilized zirconia)<br/>