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Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide: Difference between revisions

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==Deposition of Silicon Oxide using sputter deposition technique==
==Deposition of Silicon Oxide using sputter deposition technique==
At DTU Nanolab you can also deposit silicon oxide using the Sputter System [[Specific Process Knowledge/Thin film deposition/Lesker|(Lesker)]] or the [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE Ionfab300]]
At DTU Nanolab you can also deposit silicon oxide using the Sputter-System [[Specific Process Knowledge/Thin film deposition/Lesker|(Lesker)]], the [[Specific_Process_Knowledge/Thin_film_deposition/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system|Sputter-System Metal Oxide(PC1)]] or the [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE Ionfab300]]
sputter system. One of the advantages here is that you can deposit on many kinds of material.
sputter system. One of the advantages here is that you can deposit on many kinds of material.


*[[/Deposition of Silicon Oxide using Lesker sputter tool|Deposition of Silicon Oxide using Lesker sputter tool]]
*[[/Deposition of Silicon Oxide using Lesker sputter tool|Deposition of Silicon Oxide using Lesker sputter tool]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide/IBSD of SiO2|Deposition of Silicon Oxide using IBE/IBSD Ionfab300]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide/IBSD of SiO2|Deposition of Silicon Oxide using IBE/IBSD Ionfab300]]
*[[Specific_Process_Knowledge/Thin_film_deposition/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Standard_recipe_performance|Deposition conditions in Sputter-System Metal Oxide(PC1)]]


==Deposition of Silicon Oxide using ALD==
==Deposition of Silicon Oxide using ALD==