Specific Process Knowledge/Thin film deposition: Difference between revisions

Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) - Cluster-based multi-chamber high vacuum sputtering deposition system
Lesker - Sputter tool
Wordentec - E-beam evaporator, sputter and thermal evaporator
Thermal evaporator
E Beam Evaporator (Temescal)
Physimeca - E-beam evaporator
IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching
Sputter coater 03 - Gold sputtering system
Sputter coater 04 - Gold sputtering system

See the Lithography/Coaters page for coating polymers

MVD - Molecular Vapor Deposition
Electroplating-Ni - Electrochemical deposition of nickel
Electroplating-Cu - Electrochemical deposition of copper
MOCVD - Epitaxial growth - Ask the department of photonics if you are interested: Elizaveta Semenova or Kresten Yvind

@@ Line 57: / Line 57: @@
 |style="background: LightGray"|
 [[/Lesker|AlCu]]<br/>
+[[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|BaTiO<sub>3</sub>]] (Barium titanate)<br/>
 [[/Lesker|CoFe]]<br/>
 [[/Lesker|CuTi]]<br/>
@@ Line 66: / Line 67: @@
 [[/Deposition of NiV|NiV]] alloy <br/>
 [[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>
-[[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|BaTiO<sub>3</sub>]] (Barium titanate)<br/>
+[[/Lesker|YSZ]] (Yttrium stabilized zirconia)<br/>
-[[/Lesker|YSZ (Yttrium stabilized zirconia)]]<br/>
 |style="background: #DCDCDC"|