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Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions

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→Deposition of Cu: added the cluster sputterer
Reet (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,736 edits
m →Deposition of Cu: added info on deposition rate
Line 43: Line 43:


! Deposition rate
! Deposition rate
|1Å/s to 10Å/s
|1-10 Å/s
| ~1Å/s
|~ 1 Å/s
| depends on process parameters
|Depends on process parameters, at least up to 8.7 Å/s, see conditions [[Specific_Process_Knowledge/Thin_film_deposition/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Standard_recipe_performance|here]]
|-
|-


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