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Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions

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Reet (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,760 edits
m →Chromium deposition: added info on deposition rate
Line 36: Line 36:
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! Deposition rate
! Deposition rate
|0.5Å/s to 10Å/s
|0.5 Å/s to 10 Å/s
|10Å/s to 15Å/s (e-beam)
|10 Å/s to 15 Å/s (e-beam)
Sputtering: Depends on process parameters. See [[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Sputtering of Cr in Wordentec|here]] and process log.
Sputtering: Depends on process parameters. See [[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Sputtering of Cr in Wordentec|here]] and process log.
|10Å/s
|10 Å/s
|Depends on process parameters. See process log.
|Depends on process parameters. At least up to 2 Å/s. See process log.
|-
|-


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